Qualcomm Snapdragon 8 Elite Gen 6 Pro surfaces with Samsung-style HPB cooling

Qualcomm Snapdragon 8 Elite Gen 6 Pro surfaces with Samsung-style HPB cooling. - 2nm process, ES chips SM8975-100-BC seen in Dec 2025/Jan 2026 packaging - LPDDR6 and LPDDR5X support; 1295-ball (LPDDR6) vs 496-ball (LPDDR5X) packages - Internal HPB heat block confirmed in packaging - Xiaomi likely first to feature in late 2025/early 2026 More Qualcomm Snapdragon 8 Elite Gen 6 Pro surfaces with Samsung-style HPB cooling. - 2nm process, ES chips SM8975-100-BC seen in Dec 2025/Jan 2026 packaging - LPDDR6 and LPDDR5X support; 1295-ball (LPDDR6) vs 496-ball (LPDDR5X) packages - Internal HPB heat block confirmed in packaging - Xiaomi likely first to feature in late 2025/early 2026 More